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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: MMBD7000LT1
NSN : 5961-01-414-9170
NIIN : 014149170
CAGE Code : 5V1P1
Manufacturer: On Semiconductor Corporation
Item Name : Semiconductor Device Diode
Thank you for your interest in our available parts and components on NSN Target. Semiconductor Device Diode is an item listed with the part number MMBD7000LT1, and it is manufactured by On Semiconductor Corporation. This particular item MMBD7000LT1 is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including MMBD7000LT1 with NSN 5961014149170 and other parts manufactured by On Semiconductor Corporation. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-414-9170 Item Description: Semiconductor Device Diode | 5961 | 014149170 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Mmbd7000lt1 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AXGY | MOUNTING METHOD | TERMINAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 BONDING PAD |
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC AND 500.00 MILLIAMPERES MAXIMUM PEAK FORWARD SURGE CURRENT |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236AB |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
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