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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: MS1801
NSN : 5961-01-212-8023
NIIN : 012128023
CAGE Code : 08JA0
Manufacturer: Microsemi Corp
Item Name : Semiconductor Devices Unitized
Thank you for your interest in our available parts and components on NSN Target. Semiconductor Devices Unitized is an item listed with the part number MS1801, and it is manufactured by Microsemi Corp. This particular item MS1801 is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including MS1801 with NSN 5961012128023 and other parts manufactured by Microsemi Corp. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-212-8023 Item Description: Semiconductor Devices Unitized | 5961 | 012128023 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | G | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Ms1801 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC AND METAL |
| ABHP | OVERALL LENGTH | 0.900 INCHES NOMINAL |
| ABKW | OVERALL HEIGHT | 0.280 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.735 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | SATELLITE COMMUNICATIONS SET,AN/WSC-3(V)9 |
| ASKA | COMPONENT NAME AND QUANTITY | 2 TRANSISTOR |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL TRANSISTOR |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MINIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, WITH BASE SHORT-CIRCUITED TO EMITTER ALL TRANSISTOR AND 32.0 MINIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN ALL TRANSISTOR AND 4.0 MINIMUM BREAKDOWN VOLTAGE, EMITTER-TO-BASE, |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 7.00 AMPERES SOURCE CUTOFF CURRENT MAXIMUM ALL TRANSISTOR |
| CTRD | POWER RATING PER CHARACTERISTIC | 270.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET ALL TRANSISTOR |
| CTRK | TRANSFER RATIO | 100.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER ALL TRANSISTOR |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| FEAT | SPECIAL FEATURES | CERAMIC CASE CONTAINS BERYLLIUM OXIDE - HANDLE AND DISPOSE IAW HAZMAT PROCEDURES; TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| PMLC | PRECIOUS MATERIAL AND LOCATION | LEADS GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 00724-20-00942 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING |
| TTQY | TERMINAL TYPE AND QUANTITY | 8 RIBBON |
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