Mfg Part Number: IM2114LMJN-883B
Alternate P/N: IM2114LMJN883B
NSN : 5962-01-151-4621
NIIN : 011514621
CAGE Code : 32293
Manufacturer: Intersil Corporation
Item Name : Microcircuit Memory
Thank you for your interest in our available parts and components on NSN Target. Microcircuit Memory is an item listed with the part number IM2114LMJN-883B, and it is manufactured by Intersil Corporation. This particular item IM2114LMJN-883B is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including IM2114LMJN-883B with NSN 5962011514621 and other parts manufactured by Intersil Corporation. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-151-4621 Item Description: MICROCIRCUIT,MEMORY | 5962 | 011514621 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
IM2114LMJN/883B | 3 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
CZER | Memory Device Type | ROM |
ADAT | Body Width | 0.220 INCHES MINIMUM AND |
CQZP | Input Circuit Pattern | 12 INPUT |
CBBL | Features Provided | HERMETICALLY SEALED AND |
CQSJ | Inclosure Material | GLASS |
CQSJ | Inclosure Material | CERAMIC AND |
ADAT | Body Width | 0.310 INCHES MAXIMUM |
CWSG | Terminal Surface Treatment | SOLDER |
CBBL | Features Provided | POSITIVE OUTPUTS |
ADAQ | Body Length | 0.960 INCHES MAXIMUM |
MRC | Decoded Requirement | Clear Text Reply |
ADAU | Body Height | 0.140 INCHES MINIMUM AND |
TEST | Test Data Document | 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CTFT | Case Outline Source And Designator | D-6 MIL-M-38510 |
AEHX | Maximum Power Dissipation Rating | 1.000 MILLIWATTS |
AGAV | End Item Identification | TELETYPEWRITER SET,AN/UGC-129(V) |
TTQY | Terminal Type And Quantity | 18 PRINTED CIRCUIT |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
CZEN | Voltage Rating And Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
ADAU | Body Height | 0.185 INCHES MAXIMUM |
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