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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: QPND-3022
Alternate P/N: QPND3022
NSN : 5961-01-467-6583
NIIN : 014676583
CAGE Code : 54893
Manufacturer: Hewlett Packard Company
Item Name : Semiconductor Device Diode
Thank you for your interest in our available parts and components on NSN Target. Semiconductor Device Diode is an item listed with the part number QPND-3022, and it is manufactured by Hewlett Packard Company. This particular item QPND-3022 is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including QPND-3022 with NSN 5961014676583 and other parts manufactured by Hewlett Packard Company. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-467-6583 Item Description: Semiconductor Device Diode | 5961 | 014676583 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Qpnd-3022 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| FEAT | SPECIAL FEATURES | HARDNESS CRITICAL ITEM |
| ABJT | TERMINAL LENGTH | 12.600 MILLIMETERS MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 2 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| ABBH | INCLOSURE MATERIAL | GLASS |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | -65.0 DEG CELSIUS CASE AND 175.0 DEG CELSIUS CASE |
| ABHP | OVERALL LENGTH | 30.000 MILLIMETERS MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| ABKW | OVERALL HEIGHT | 2.400 MILLIMETERS MAXIMUM |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 NANOAMPERES MAXIMUM REVERSE CURRENT, DC |
| ABMK | OVERALL WIDTH | 5.100 MILLIMETERS MAXIMUM |
| CTRD | POWER RATING PER CHARACTERISTIC | 200.0 WATTS MAXIMUM NONREACTIVE POWER INPUT, INSTANTANEOUS TOTAL, TO ALL TERMINALS |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR TO EMITTER, SUSTAINED AND 100.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN |
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