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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: QPND-4071
Alternate P/N: QPND4071
NSN : 5961-01-367-1967
NIIN : 013671967
CAGE Code : 54893
Manufacturer: Hewlett Packard Company
Item Name : Semiconductor Device Diode
Thank you for your interest in our available parts and components on NSN Target. Semiconductor Device Diode is an item listed with the part number QPND-4071, and it is manufactured by Hewlett Packard Company. This particular item QPND-4071 is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including QPND-4071 with NSN 5961013671967 and other parts manufactured by Hewlett Packard Company. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-367-1967 Item Description: Semiconductor Device Diode | 5961 | 013671967 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | G | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Qpnd-4071 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 0.670 INCHES MINIMUM AND 0.710 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 0.200 INCHES MINIMUM AND 0.225 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.400 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.175 INCHES MINIMUM AND 0.225 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | B-2 AIRCRAFT |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | GOLD PLATED LEADS |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 MINIMUM BREAKDOWN VOLTAGE, DC AND 0.98 MAXIMUM FORWARD VOLTAGE, DC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 NANOAMPERES FORWARD CURRENT, AVERAGE PEAK |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 TAB, SOLDER LUG |
| FEAT | SPECIAL FEATURES | HARDNESS CRITICAL PROCESS; JUNCTION PATTERN ARRANGEMENT: PN |
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