Mfg Part Number: QSRD-4645
Alternate P/N: QSRD4645
NSN : 5961-01-357-1125
NIIN : 013571125
CAGE Code : 54893
Manufacturer: Hewlett Packard Company
Item Name : Semiconductor Device Diode
Thank you for your interest in our available parts and components on NSN Target. Semiconductor Device Diode is an item listed with the part number QSRD-4645, and it is manufactured by Hewlett Packard Company. This particular item QSRD-4645 is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including QSRD-4645 with NSN 5961013571125 and other parts manufactured by Hewlett Packard Company. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-357-1125 Item Description: Semiconductor Device Diode | 5961 | 013571125 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Qsrd-4645 | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL |
ABMK | OVERALL WIDTH | 0.015 INCHES NOMINAL |
AXGY | MOUNTING METHOD | PRESS FIT |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS |
CTRG | CAPACITANCE RATING IN PICOFARADS | 0.1 MINIMUM AND 0.37 MAXIMUM |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
TTQY | TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
ABHP | OVERALL LENGTH | 0.015 INCHES NOMINAL |
FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEM |
CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
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