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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: 1858-0023
Alternate P/N: 18580023
NSN : 5961-01-141-5672
NIIN : 011415672
CAGE Code : 28480
Manufacturer: Hewlett Packard Company
Item Name : Semiconductor Devices Unitized
Thank you for your interest in our available parts and components on NSN Target. Semiconductor Devices Unitized is an item listed with the part number 1858-0023, and it is manufactured by Hewlett Packard Company. This particular item 1858-0023 is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including 1858-0023 with NSN 5961011415672 and other parts manufactured by Hewlett Packard Company. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-141-5672 Item Description: Semiconductor Devices Unitized | 5961 | 011415672 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 1858-0023 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC |
| ABHP | OVERALL LENGTH | 0.785 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 0.120 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.280 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.300 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 14 |
| ASKA | COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN ALL SEMICONDUCTOR AND 40.0 MAXIMUM WORKING PEAK OFF-STATE VOLTAGE ALL SEMICONDUCTOR |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 0.50 MILLIAMPERES SOURCE CUTOFF CURRENT MAXIMUM OF STANDARD RANGE ALL SEMICONDUCTOR |
| CTRD | POWER RATING PER CHARACTERISTIC | 1900.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-EMITTER ABSOLUTE ALL SEMICONDUCTOR |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | -65.0 DEG CELSIUS CASE AND 175.0 DEG CELSIUS CASE |
| FEAT | SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 UNINSULATED WIRE LEAD |
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