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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: 170208-01
Alternate P/N: 17020801
NSN : 5962-01-421-1336
NIIN : 014211336
CAGE Code : 35351
Manufacturer: Ge Aviation Systems Llc
Item Name : Microcircuit Memory
Thank you for your interest in our available parts and components on NSN Target. Microcircuit Memory is an item listed with the part number 170208-01, and it is manufactured by Ge Aviation Systems Llc. This particular item 170208-01 is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including 170208-01 with NSN 5962014211336 and other parts manufactured by Ge Aviation Systems Llc. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-421-1336 Item Description: Microcircuit Memory | 5962 | 014211336 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 170208-01 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| NHCF | Nuclear Hardness Critical Feature | HARDENED |
| CZEQ | Time Rating Per Chacteristic | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| MRC | Decoded Requirement | Clear Text Reply |
| AEHX | Maximum Power Dissipation Rating | 495.0 MILLIWATTS |
| CQSJ | Inclosure Material | CERAMIC |
| TTQY | Terminal Type And Quantity | 32 LEADLESS |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | RAM |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
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